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플립칩 패키지의 무전해 니켈 UBM 형성 : Electroless Nickel UBM formation of flip package
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- Authors
- Advisor
- 이동녕
- Issue Date
- 2002
- Publisher
- 서울대학교 대학원
- Keywords
- 아연 치환 ; flip chip package ; 무전해 니켈 도금 ; zincating ; 플립칩 패키징 ; alkaline zincating ; Under Bump Metallurgy(UBM) ; acidic zincating ; 아연 박리 ; electrolsess nickel plating
- Description
- 학위논문(박사)--서울대학교 대학원 :재료공학부,2002.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000063190
https://hdl.handle.net/10371/35407
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