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Analysis of the flow-field during Chemical Mechanical Polishing(CMP) using Particle Image Velocimetry(PIV) : PIV를 이용한 화학적 기계학적 연마공정 중의 연마액 유동 분석
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 윤영빈 | - |
| dc.contributor.author | 신상희 | - |
| dc.date.accessioned | 2010-01-26T03:50:00Z | - |
| dc.date.available | 2010-01-26T03:50:00Z | - |
| dc.date.copyright | 2005. | - |
| dc.date.issued | 2005 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000051123 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/44427 | - |
| dc.description | Thesis(master`s)--서울대학교 대학원 :기계항공공학부,2005. | en |
| dc.format.extent | vi, 58 leaves | en |
| dc.language.iso | en | en |
| dc.publisher | 서울대학교 대학원 | en |
| dc.subject | 화학적 기계학적 연마 | en |
| dc.subject | Chemical Mechanical Polishing | en |
| dc.subject | 윤활 | en |
| dc.subject | Particle Image Velocimetry | en |
| dc.subject | 연마액의 속도 분포 | en |
| dc.subject | Velocity distribution of slurry | en |
| dc.subject | PIV | en |
| dc.subject | Slurry film thickness | en |
| dc.subject | 연마액 피막 두께 | en |
| dc.subject | Lubrication | en |
| dc.title | Analysis of the flow-field during Chemical Mechanical Polishing(CMP) using Particle Image Velocimetry(PIV) | en |
| dc.title.alternative | PIV를 이용한 화학적 기계학적 연마공정 중의 연마액 유동 분석 | en |
| dc.type | Thesis | - |
| dc.contributor.department | 기계항공공학부 | - |
| dc.description.degree | Master | en |
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