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저온 동시 소결 세라믹 (LTCC) 기판과 금-주석 공융 접합층을 이용한 RF MEMS 소자의 실장에 대한 연구 : (A)study on LTCC-based RF MEMS package using gold-tin eutectic bonding
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- Authors
- Advisor
- 김용권
- Issue Date
- 2007
- Publisher
- 서울대학교 대학원
- Keywords
- LTCC ; LTCC ; 금-주석 ; gold-tin ; 공융접합 ; eutectic bonding ; RF MEMS ; package ; 실장 ; vertical feedthrough ; 수직신호연결 ; hermeticity ; 밀봉도
- Description
- 학위논문(석사) --서울대학교 대학원 :전기. 컴퓨터공학부,2007.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000043902
https://hdl.handle.net/10371/52511
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