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회분식 전해조에서 PCB 식각폐수의 재생 및 구리의 회수
Regeneration of PCB Etchants and Copper Recovery in a Batch - type Electrolytic Cell

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Authors
남상철; 남종우; 탁용석; 오승모
Issue Date
1997
Publisher
한국공업화학회 = The Korean Society of Industrial and Engineering Chemistry
Citation
J. of Korean Ind. & Eng. Chemistry, 8, 161(1997)
Abstract
인쇄회로기판의 식각폐수를 전기화학적 방법을 이용하여 양극에서 이를 재생하고, 음극에서 구리를 석출하기 위한 실험을 행하였다. 양극에서의 Cu(I)의 산화에 따른 Cu(I)/Cu(Ⅱ) 변화는 Pt와 Ag/AgCl/4M KCl 전극사이의 전위차를 이용하여 측정하였으며, 반응의 진행에 따른 양극에서의 염소기체 발생은 용액내에 Cu(I)의 농도를 일정치 이상으로 유지시키고, 비다공성 흑연전극을 이용하여 억제할 수 있었다. 그리고, 음극에서의 구리석출은 전류밀도 360㎃/㎠, 구리이온농도 12g/ℓ 일때 가장 효율적이며 석출된 구리는 dendrite구조임을 알 수 있었다. 또한 석출효율과 회수방법을 고려할 때 음극으로서 Ti전극을 사용할 경우 가장 우수한 효율을 얻을 수 있었다. 전해온도가 증가함에 따라서 전류효율은 낮아졌으며, 전력효율은 50℃에서 최대값을 나타내었다.
Anodic regeneration of PCB enchant and cathodic deposition of copper using electrochemical method has been studied. Cu(I)/Cu(Ⅱ) concentration ratio as a function of Cu(I) oxidation at the anode was measured from the potential difference between platinum and Ag/AgCl/4M KCl electrodes. Chlorine gas evolution was minimized by maintaining Cu(I) concentration above a specific concentration and using non-porous graphite electrode. Dendritic copper deposition was observed at the cathode and the optimum conditions for Cu deposition was identified as the current density of 360㎃/㎠, and copper concentration of 12 g/ℓ. Titanium was the most effective cathode material which showed a higher current efficiency and copper recovery. The current efficiency decreased with increasing temperature, but the highest power efficiency was achieved at 50℃.
ISSN
1225-0112
Language
Korean
URI
http://kiss.kstudy.com/search/detail_view.asp?key=178211

http://hdl.handle.net/10371/5963
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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