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Metal-core printed circuit board with dielectric layer by aerosol deposition process
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 김형준 | - |
| dc.contributor.author | 조현민 | - |
| dc.date.accessioned | 2010-05-04T04:46:04Z | - |
| dc.date.available | 2010-05-04T04:46:04Z | - |
| dc.date.copyright | 2010 | - |
| dc.date.issued | 2010 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000032465 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/63866 | - |
| dc.description | Thesis(doctors) --서울대학교 대학원 :재료공학부,2010.2. | en |
| dc.format.extent | xiv, 144 leaves | en |
| dc.language.iso | en | en |
| dc.publisher | 서울대학교 대학원 | en |
| dc.subject | 에어로졸 증착법 | en |
| dc.subject | MCPCB(Metal-Core Printed Circuit Board) | en |
| dc.subject | 알루미나 | en |
| dc.subject | Light Emitting Diode(LED) | en |
| dc.subject | 유전층 | en |
| dc.subject | Dielectric layer | en |
| dc.subject | 발광다이오드 | en |
| dc.subject | Aerosol Deposition | en |
| dc.subject | 열저항 | en |
| dc.subject | Al2O3 | en |
| dc.subject | 인쇄회로기판 | en |
| dc.subject | Thermal Resistance | en |
| dc.title | Metal-core printed circuit board with dielectric layer by aerosol deposition process | en |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Doctor | en |
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