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Additives for Super-conformal Electroplating of Ag Thin Film for ULSIs

Cited 31 time in Web of Science Cited 35 time in Scopus
Authors
Ahn, Eung Jin; Kim, Jae Jeong
Issue Date
2004-09-07
Publisher
Electrochemical Society
Citation
Electrochemical and Solid-State Letters, 7(10) C118-C120
Keywords
silveradditivesmetallic thin filmselectroplatinginhibitorselectrolytescopperorganic compounds
Abstract
For Ag electroplating in a damascene structure, two additives were tried in the electrolyte composed of KAg(CN)2 and KCN. One
additive, thiourea, played a role as a suppressor and a brightener on a Ag seed layer. The other additive, benzotriazole, worked as
an inhibitor on a Cu seed layer whereas it acted as an accelerator on the Ag seed layer. When these two additives were added to
the electrolyte, the superconformal electroplating of Ag thin film for ultralarge scale integrateds ~ULSIs! was accomplished
successfully without defects in the damascene structure with a width of 400 nm and an aspect ratio was 4.
ISSN
1099-0062
Language
English
URI
http://hdl.handle.net/10371/66000
DOI
https://doi.org/10.1149/1.1793811
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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