Publications
Detailed Information
Superconformal Cu Electrodeposition on Various Substrates
Cited 24 time in
Web of Science
Cited 23 time in Scopus
- Authors
- Issue Date
- 2004-11-29
- Publisher
- Electrochemical Society
- Citation
- Electrochemical and Solid-State Letters, 8(1), C19-C21
- Keywords
- copper ; titanium compounds ; ruthenium ; metallic thin films ; MOCVD ; electroless deposition ; interconnections
- Abstract
- For application to Cu interconnection, superconformal electrodeposition has been performed on various substrates, including
physical vapor deposited ~PVD! Cu, two kinds of electroless deposited ~ELD! Cu, TiN barrier, and metallorganic chemical vapor
deposited Ru. ELD Cu with HCHO as the reducing agent was compatible with PVD Cu in terms of conformal characteristics and
film continuity. Both PVD and ELD Cu seed layers enabled superconformal filling with distinct bumps. Superfilling was also
attained on resistive substrates of TiN and Ru through Pd activation and subsequent slight seeding by electrodeposition to enhance
the action of additives.
- ISSN
- 1099-0062
- Language
- English
- Files in This Item:
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.