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Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition

Cited 22 time in Web of Science Cited 21 time in Scopus
Authors
Kim, Soo-Kil; Hwang, Soonsik; Cho, Sung Ki; Kim, Jae Jeong
Issue Date
2005-12-06
Publisher
Electrochemical Society
Citation
Electrochemical and Solid-State Letters, 9 (2), C25-C28
Keywords
copperelectrodepositionchemical mechanical polishing
Abstract
To enhance the compatibility of electrodeposition with the chemical mechanical polishing process, we attempted to prevent step
formation on active areas. In the absence of benzotriazole BTA , the step heights increased with the decrease in the pattern width
and the increase in the pattern density due to the locally condensed accelerator. However, the addition of BTA significantly
suppressed the deposition kinetic through the deactivation of the accelerator. The two-step electrodeposition with modulated
accelerator and BTA concentrations was found to be effective in the retardation of bump formation and the prevention of bumps
from growing without an impact on the superfilling.
ISSN
1099-0062
Language
English
URI
http://hdl.handle.net/10371/66127
DOI
https://doi.org/10.1149/1.2139976
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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