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Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid

Cited 8 time in Web of Science Cited 10 time in Scopus
Authors
Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong
Issue Date
2007-11-14
Publisher
Electrochemical Society
Citation
Electrochemical and Solid-state Letters, 11(1), D18-D21
Abstract
This paper describes electroless Cu filling of trenches with different widths ranging from 130 to 300 nm, using a concentrationdependent
effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid DPS . With a fixed DPS concentration, it is
shown that these trenches with different dimensions cannot be superfilled simultaneously. This is presumably caused by different
surface concentrations of the adsorbed additive, which depends on the feature size and surface area. A two-step filling method is
employed to superfill those trenches, which is also effective in control of the deposited Cu amounts to obtain uniform growth front
regardless of the trench dimensions.
ISSN
1099-0062
Language
English
URI
http://hdl.handle.net/10371/68287
DOI
https://doi.org/10.1149/1.2798877
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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