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Electroless Gold Plating on Aluminum Patterned Chips for CMOS-based Sensor Applications
Cited 19 time in
Web of Science
Cited 21 time in Scopus
- Authors
- Issue Date
- 2009-11-13
- Publisher
- Electrochemical Society
- Citation
- Journal of The Electrochemical Society, 157(1), D46-D49
- Abstract
- We presented an approach for the activation of aluminum Al alloy using palladium Pd and the subsequent gold Au electroless
plating ELP for complementary metal oxide semiconductor CMOS -based sensor applications. In this study, CMOS process
compatible Al patterned chips were used as substrates for easy incorporation with existing CMOS circuits. To improve the contact
resistance that arose from the Schottky barrier between the metal electrodes and the single-walled carbon nanotubes SWCNTs ,
electroless deposition of gold that has a higher work function than Al was adopted because the SWCNTs has p-type semiconductor
properties. Each step of the Au ELP procedure was studied under various bath temperatures, immersion times, and chemical
concentrations. Fine Pd particles were homogeneously distributed on the Al surface by the Pd activation process at room temperature.
Au ELP allowed selective deposition of the Au film on the activated Al surface only. The SWCNT networks formed on
the Au plated chip by a dip-coating method showed improved contact resistance and resistance variation between the Au electrode
and SWCNTs. We also tried SWCNT decoration with the Au particle using the upper Au ELP method, which was expected to be
applied in various areas including field-effect transistors and sensor devices.
- ISSN
- 0013-4651
- Language
- English
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