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Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Koo, Hyo-Chol | - |
dc.contributor.author | Kim, Seo Young | - |
dc.contributor.author | Cho, Sung Ki | - |
dc.contributor.author | Kim, Jae Jeong | - |
dc.date.accessioned | 2010-07-05T06:18:01Z | - |
dc.date.available | 2010-07-05T06:18:01Z | - |
dc.date.issued | 2008-07-08 | - |
dc.identifier.citation | Journal of The Electrochemical Society, 155(9), D558-D562 | en |
dc.identifier.issn | 0013-4651 | - |
dc.identifier.uri | https://hdl.handle.net/10371/68293 | - |
dc.description.abstract | A high density of Pd catalytic particles is an important factor for obtaining a uniform and continuous Ag seed layer in electroless
plating. Adequate surface pretreatment is critical for the formation of such a Pd catalytic particle population. In this study, electroless plating of Ag thin films on TiN substrates was performed using Sn sensitization and Pd activation as pretreatment methods. Sn surface sensitization improves surface wetting and aids in the formation of a Pd catalytic layer in surface-oxidative Pd activation. The Pd activation supported by Sn sensitization also accelerated the formation of a continuous thin Ag film. Furthermore, a thin Ag seed layer deposited on a patterned structure showed excellent conformality. | en |
dc.description.sponsorship | This work was supported by KOSEF through the Research Center
for Energy Conversion and Storage, and the Institute of Chemical Processing in Seoul National University. | en |
dc.language.iso | en | en |
dc.publisher | Electrochemical Society | en |
dc.title | Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection | en |
dc.type | Article | en |
dc.contributor.AlternativeAuthor | 구효철 | - |
dc.contributor.AlternativeAuthor | 김서영 | - |
dc.contributor.AlternativeAuthor | 조성기 | - |
dc.contributor.AlternativeAuthor | 김재정 | - |
dc.identifier.doi | 10.1149/1.2948365 | - |
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