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Crystallization of Amorphous Silicon Thin Film by Using a Thermal Plasma Jet

DC Field Value Language
dc.contributor.authorLee, Hyun Seok-
dc.contributor.authorChoi, Sooseok-
dc.contributor.authorKim, Sung Woo-
dc.contributor.authorHong, Sang Hee-
dc.date.accessioned2010-08-20T05:15:28Z-
dc.date.available2010-08-20T05:15:28Z-
dc.date.issued2009-05-29-
dc.identifier.citationThin Solid Films 517 (2009) 4070-4073en
dc.identifier.issn0040-6090-
dc.identifier.urihttps://hdl.handle.net/10371/69100-
dc.descriptionAuthor's versionen
dc.description.abstractAmorphous silicon (a-Si) films deposited on glass substrates were crystallized using a thermal plasma jet and the treated films are analyzed to find the relationship between plasma characteristics and crystallization process conditions. The crystallization process conditions were found to have different optimal operating regimes depending on the nozzle geometry. Numerical analysis of the thermal plasma jets showed that the different operating regimes for crystallization were caused by modifications of the plasma characteristics by the nozzle geometry. It is revealed that a stepped-divergent nozzle is more efficient for the thermal plasma annealing process than the conventional cylindrical one due to the broadened high-temperature region and the lowered axial velocity in the plasma jet.en
dc.description.sponsorshipMinistry of Knowledge Economy, Regional Innovation Center for Ecvironmental Technology of Thermal Plasma at Inha Universityen
dc.language.isoenen
dc.publisherElsevieren
dc.subjectcrystallizationen
dc.subjectpolycrystalline siliconen
dc.subjectthermal plasma annealingen
dc.subjectanode nozzle geometryen
dc.titleCrystallization of Amorphous Silicon Thin Film by Using a Thermal Plasma Jeten
dc.typeArticleen
dc.contributor.AlternativeAuthor이현석-
dc.contributor.AlternativeAuthor최수석-
dc.contributor.AlternativeAuthor김성우-
dc.contributor.AlternativeAuthor홍상희-
dc.identifier.doi10.1016/j.tsf.2009.01.138-
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