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Showing results 1 to 4 of 4

Issue Date	Title / Author(s) / Citation	File
2002-12	Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer Kim, Jae Jeong; Kim, Yong Shik; Kim, Soo-Kil Electrochemical and Solid-State Letters, 6 (2), C17-C20	view file DOI
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2003-01	catalytic behavior of MPSA(3-mercapto-1-propane sulfonic acid) on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization. Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of Electroanalytical Chemistry 542 (2003) 61-66	DOI
2003-12	Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of the Electrochemical Society, 151, C97-C101	view file DOI