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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2017	Enhanced Thermal Conductivity of the Underfill Materials Using Insulated Core/shell Filler Particles for High Performance Flip Chip Applications Kim, Tae-Ryong; Joo, Kisu; Lim, Boo Taek; Choi, Sung-Soon; Lee, Boung Ju; Yoon, Eui Joon; Jeong, Se Young; Yim, Myung Jin Proceedings - Electronic Components and Technology Conference, pp.1340-1347	DOI
2018-05	Enhancements on Underfill Materials' Thermal Conductivity by Insulation Coating Layer Control of Conductive Particles Kim, Tae-Ryong; Joo, Kisu; Lim, Boo Taek; Choi, Sung-Soon; Lee, Boung Ju; Yoon, Euijoon; Jeong, Se Young; Yim, Myung Jin 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), pp.2431-2436	DOI