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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2022-06	Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence Choi, Chanyeol; Kim, Hyunseok; Kang, Ji-Hoon; Song, Min-Kyu; Yeon, Hanwool; Chang, Celesta S.; Suh, Jun Min; Shin, Jiho; Lu, Kuangye; Park, Bo-In; Kim, Yeongin; Lee, Han Eol; Lee, Doyoon; Lee, Jaeyong; Jang, Ikbeom; Pang, Subeen; Ryu, Kanghyun; Bae, Sang-Hoon; Nie, Yifan; Kum, Hyun S.; Park, Min-Chul; Lee, Suyoun; Kim, Hyung-Jun; Wu, Huaqiang; Lin, Peng; Kim, Jeehwan Nature Electronics, Vol.5 No.6, pp.386-393	DOI
2022-08	Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors Kim, Yeongin; Suh, Jun Min; Shin, Jiho; Liu, Yunpeng; Yeon, Hanwool; Qiao, Kuan; Kum, Hyun S.; Kim, Chansoo; Lee, Han Eol; Choi, Chanyeol; Kim, Hyunseok; Lee, Doyoon; Lee, Jaeyong; Kang, Ji-Hoon; Park, Bo-In; Kang, Sungsu; Kim, Jihoon; Kim, Sungkyu; Perozek, Joshua A.; Wang, Kejia; Park, Yongmo; Kishen, Kumar; Kong, Lingping; Palacios, Tomás; Park, Jungwon; Park, Min-Chul; Kim, Hyung-Jun; Lee, Yun Seog; Lee, Kyusang; Bae, Sang-Hoon; Kong, Wei; Han, Jiyeon; Kim, Jeehwan Science, Vol.377 No.6608, pp.859-864	DOI