Author
Showing results 1 to 15 of 15
Issue Date | Title / Author(s) / Citation | File | Altmetrics |
---|---|---|---|
2003 | American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, Vol.374 No.3, pp.131-140 | DOI | |
2004 | Proceedings of the ASME Heat Transfer/Fluids Engineering Summer Conference 2004, HT/FED 2004, Vol.4, pp.597-605 | DOI | |
2005 | ELECTRONIC AND PHOTONIC PACKAGING, INTEGRATION AND PACKAGING OF MICRO/NANO/ELECTRONIC SYSTEMS, pp.599-603 | DOI | |
2006 | American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP | DOI | |
2006 | Proceedings of SPIE - The International Society for Optical Engineering, Vol.6106 | DOI | |
2006 | Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Vol.PART C, pp.1935-1941 | ||
2006-10 | Applied Physics Letters, Vol.89 No.14, p. 141126 | DOI | |
2007 | PHOTON PROCESSING IN MICROELECTRONICS AND PHOTONICS VI, Vol.6458 | DOI | |
2007 | LASER-BASED MICRO- AND NANOPACKAGING AND ASSEMBLY, Vol.6459 | DOI | |
2007-02 | Sensors and Actuators, A: Physical, Vol.134 No.1, pp.161-168 | DOI | |
2007-04 | Applied Physics Letters, Vol.90 No.14, p. 141103 | DOI | |
2007-08 | Nanotechnology, Vol.18 No.34, p. 345202 | DOI | |
2007-11 | Journal of Applied Physics, Vol.102 No.9, p. 093102 | DOI | |
2008-08 | Applied Physics A: Materials Science and Processing, Vol.92 No.3, pp.579-587 | DOI | |
2012-05 | Journal of Micromechanics and Microengineering, Vol.22 No.5, p. 055022 | DOI |