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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2022-09	Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps Kim, Gahui; Son, Kirak; Lee, Jang-Hee; Joo, Young-Chang; Park, Young-Bae Electronic Materials Letters, Vol.18 No.5, pp.431-439	DOI