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Showing results 1 to 19 of 19

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2008-12	Morphology and Chemistry of Oxide Inclusions After Al and Ti Complex Deoxidation Sun, Min-Ki; Jung, In-Ho; Lee, Hae-Geon Metals and Materials International, Vol.14 No.6, pp.791-798	DOI
2010-03	Approaches toward efficient and stable electron extraction contact in organic photovoltaic cells: Inspiration from organic light-emitting diodes Lee, Tae-Woo; Lim, Kyung-Guen; Kim, Dong-Hun Electronic Materials Letters, Vol.6 No.1, pp.41-50	DOI
2011-06	Invited paper: Preparation and electrochemical characterization of doped spinel LiMn1.88Ge0.1Li0.02O4 cathode material Kim, Sung-Wook; Kumar, Vadam Ganesh; Seo, Dong-Hwa; Park, Young-Uk; Kim, Jinsoo; Kim, Haegyeom; Kim, Jongsoon; Hong, Jihyun; Kang, Kisuk Electronic Materials Letters, Vol.7 No.2, pp.105-108	DOI
2016-03	Atomic thin titania nanosheet-coupled reduced graphene oxide 2D heterostructures for enhanced photocatalytic activity and fast lithium storage Li, Dong Jun; Huang, Zhegang; Hwang, Tae Hoon; Narayan, Rekha; Choi, Jang Wook; Kim, Sang Ouk Electronic Materials Letters, Vol.12 No.2, pp.211-218	DOI
2017-03	Glyoxalated polyacrylamide as a covalently attachable and rapidly cross-linkable binder for Si electrode in lithium ion batteries Yoo, Jung-Keun; Jeon, Jaebeom; Kang, Kisuk; Jung, Yeon Sik Electronic Materials Letters, Vol.13 No.2, pp.136-141	DOI
2017-05	Effects of C and Si on strain aging of strain-based API X60 pipeline steels Sung, Hyo Kyung; Lee, Dong Ho; Lee, Sunghak; Lee, Byeong-Joo; Hong, Seung-Pyo; Kim, Young-Woon; Yoo, Jang Yong; Hwang, Byoungchul; Shin, Sang Yong Metals and Materials International, Vol.23 No.3, pp.450-458	DOI
2018-01	Electrophoretic kinetics of concentrated TiO2 nanoparticle suspensions in aprotic solvent Lee, So-Yeon; Yim, Jung-Ryoul; Lee, Se-Hee; Choi, In Suk; Nam, Ki Tae; Joo, Young-Chang Electronic Materials Letters, Vol.14 No.1, pp.79-82	DOI
2018-07	Reliability issues and solutions in flexible electronics under mechanical fatigue Yi, Seol-Min; Choi, In Suk; Kim, Byoung-Joon; Joo, Young-Chang Electronic Materials Letters, Vol.14 No.4, pp.387-404	DOI
2020-08	Improvement of Mechanical Properties of Zr-Based Bulk Amorphous Alloys by High Temperature Heat Treatment Jeon, Changwoo; Jo, Min Chul; Lee, Juho; Park, Eun Soo; Park, Junho; Shin, Sang Yong Metals and Materials International, Vol.26 No.8, pp.1144-1151	DOI
2020-09	Operation Range-Optimized Silver Nanowire Through Junction Treatment Lee, Jae-Chan; Lee, Jong-Sung; Won, Phillip; Park, Jung Jae; Choi, Seok Hwan; Ko, Seung Hwan; Kim, Byoung-Joon; Lee, So-Yeon; Joo, Young-Chang Electronic Materials Letters, Vol.16 No.5, pp.491-497	DOI
2022	Insulation Coating of Fe–Si–Cr Soft Magnetic Powder by Selective Oxidation Park, Jae-Young; Park, Kwangsuk; Seo, Bosung; Fadonougbo, Julien O.; Na, Tae-Wook; Park, Ki Beom; Im, Hyeon-Tae; Hwang, Nong Moon; Park, Hyung-Ki Metals and Materials International	DOI
2022-05	Recent Progress in Carbon Electrodes for Efficient and Cost-Benign Perovskite Optoelectronics Kim, Jihyun; Yun, Alan Jiwan; Park, Byungwoo; Kim, Jinhyun Electronic Materials Letters, Vol.18 No.3, pp.232-255	DOI
2022-05	Recent Progress in Shape-Transformable Materials and Their Applications Lee, Yu-Ki; Kim, Juhee; Lien, Jyh-Ming; Lee, Young-Joo; Choi, In-Suk Electronic Materials Letters, Vol.18 No.3, pp.215-231	DOI
2022-07	Interfacial Engineering of In2O3/In2S3 Heterojunction Photoanodes for Photoelectrochemical Water Oxidation Lee, Bo Reum; Choi, Sungkyun; Cheon, Woo Seok; Yang, Jin Wook; Lee, Mi Gyoung; Park, So Hyeon; Jang, Ho Won Electronic Materials Letters, Vol.18 No.4, pp.391-399	DOI
2022-09	열가소성 성형을 이용한 비정질 합금의 홀로그램 임프린팅 공정 최적화 Ha Ryu, Wook; Ryu, Chae Woo; Kim, Kyung Jun; Kwak, Min Kyung; Park, Eun Soo 대한금속·재료학회지, Vol.60 No.9, pp.644-653	DOI
2022-09	Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps Kim, Gahui; Son, Kirak; Lee, Jang-Hee; Joo, Young-Chang; Park, Young-Bae Electronic Materials Letters, Vol.18 No.5, pp.431-439	DOI
2022-09	Interfacial Adhesion Energies of Uniformly Self-Formed Cr2O3 Barriers for Advanced Co Interconnects Lee, Seongi; Hwang, Soon-Gyu; Kim, Gahui; Kim, Cheol; Kwon, Woobin; Park, Young-Bae; Joo, Young-Chang Electronic Materials Letters, Vol.18 No.5, pp.447-455	DOI
2022-10	Incremental Tube Forming Process with a Novel Free Rotating Bearing Tool Tip: Experiment and FE Modeling with Anisotropic Plasticity Model Lee, Hyung-Rim; Lee, Myoung-Gyu; Park, Namsu Metals and Materials International, Vol.28 No.10, pp.2356-2370	DOI
2024-01	Copper Bonding Technology in Heterogeneous Integration Lee, Yoon-Gu; McInerney, Michael; Joo, Young Chang; Choi, In Suk; Kim, Sarah Eunkyung Electronic Materials Letters, Vol.20 No.1, pp.1-25	DOI

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