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Evaluation of Thinfilm Adhesion
압입시험을 이용한 박막의 계면 접착력 평가

DC Field Value Language
dc.contributor.advisor권동일-
dc.contributor.author김종헌-
dc.date.accessioned2017-07-13T05:50:00Z-
dc.date.available2017-07-13T05:50:00Z-
dc.date.issued2016-02-
dc.identifier.other000000132686-
dc.identifier.urihttp://hdl.handle.net/10371/118057-
dc.description학위논문 (박사)-- 서울대학교 대학원 : 공과대학 재료공학부, 2016. 2. 권동일.-
dc.description.abstractRecently materials are used to artificially bonding the different materials as a conventional single material. Since the interface that is artificially bonding of different materials, relatively weak section than the film and the substrate. So, the most preferentially failure occurs in a variety of external conditions. That is why the adhesion is regarded as the major property in determining the reliability of the product in a thin film system. The study was continued by many researchers to evaluate the quantitative adhesion for a long time, so that a variety of test methods have been developed. However, most of the conventional methods for evaluating adhesion, based on interfacial separation methods and interfacial fracture method, have limitations.
There are three important issues in evaluating the quantitative value of adhesion: the first, effect of film/substrate deformation and fracture is important to the adhesion test results. so, it is necessary to re-interpret the results through the analysis of the film and substrate effect. Second, need to accurate measurement of the crack length and area for a few nanometer thickness film. And third, the applicable test method limited by the characteristics of the material. In the case of hard films, fracture or delamination of the film occurs before the interface. For the bending test, film or substrate should be a bending above certain level. In other words, evaluation for very soft materials is possible.
In this thesis, in order to overcome the conventional testing method limitations, a new model proposed using the instrumented indentation test(IIT). Instrumented indentation testing (IIT) has recently attracted significant research interest in this connection, since its testing procedure is relatively simple and can be performed locally and above all high load- displacement resolution.
Indentation testing at the thin-film system sample may also obtain a load-displacement curve that included the effect the combination of the thin film/substrate and the interface unlike Bulk sample testing. To interpret the load-displacement curve, "Total work of indentation" in the thin-film system was defined the sum of "work of film" and "work of substrate" and "work of adhesion". Using the formulated hardness, modeling for work of film and substrate plastic deformation effect at indentation test condition. Also, assume that relatively soft materials of plastic volume constraint by the hard materials. Constraint plastic zone volume of a relatively soft material by the interface was defined by the interface parameter. The interface parameter derived using the Expanding Cavity Model and interfacial constraint effect. Based on the previous analysis deriving the work of the adhesion excluding the film/substrate deformation effect. The work of adhesion varies with the experimental conditions, it was constraint volume normalization. Finally the adhesion evaluation method using the indentation test was proposed.
To verify the validity of the proposed model, compared to indentation test and SAICAS test, a kind of peel test for metal/ceramic based thin film specimens. The results between two methods show good agreement. Those results show that indentation test is effective for estimation of thin-film adhesion.
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dc.description.tableofcontentsChapter 1. Introduction 1
1.1. Objective of the Thesis 2
1.2. Organization of the Thesis 6

Chapter 2. Research Background 11
2.1. Adhesion evaluation method 12
2.1.1. True work of adhesion 12
2.1.2. Practical Work of Adhesion 14
2.2. Instrumented indentation tests 19
2.2.1. Elastic Contact mechanics 20
2.2.2. Elastic-Plastic Contact mechanics 26
2.3. Nanoindentation 35
2.3.1. Development 35
2.3.2. Application 40

Chapter 3. Theoretical Modeling 68
3.1. Thin-film indentation 69
3.2. Interfacial Constraint Effect 71
3.3. Interface parameter 76
3.4. Factor analysis 79
3.5. Modeling 81
3.5.1 Film constraint 82
3.5.2 Substrate constraint 83
3.6 Physical meaning of equation 85

Chapter 4. Verification of models 98
4.1. Experimental Details 99
4.1.1. Sample preparation 99
4.1.2. Experiment conditions 101
4.2. Results & Discussion 103
4.2.1. Comparison with SAICAS method 103
4.2.2. Analysis of indentation parameter 104

Chapter 5. Conclusion 120

Reference 126

Abstract in Korean (초록) 134
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dc.formatapplication/pdf-
dc.format.extent1716689 bytes-
dc.format.mediumapplication/pdf-
dc.language.isoen-
dc.publisher서울대학교 대학원-
dc.subjectAdhesion-
dc.subjectNanoindentation-
dc.subject.ddc620-
dc.titleEvaluation of Thinfilm Adhesion-
dc.title.alternative압입시험을 이용한 박막의 계면 접착력 평가-
dc.typeThesis-
dc.description.degreeDoctor-
dc.citation.pages137-
dc.contributor.affiliation공과대학 재료공학부-
dc.date.awarded2016-02-
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Ph.D. / Sc.D._재료공학부)
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