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Effect of backstitch tool path on machinability of micro-drilling for printed circuit board
인쇄회로기판의 마이크로 드릴링 가공성에서의 박음질 가공 경로의 효과

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Authors
문종설
Advisor
안성훈
Major
공과대학 기계항공공학부
Issue Date
2013-02
Publisher
서울대학교 대학원
Keywords
Micro-drillingMicro-machiningPrinted circuit boardTool path planning
Description
학위논문 (석사)-- 서울대학교 대학원 : 기계항공공학부, 2013. 2. 안성훈.
Abstract
As electronic components have become smaller, micro-drilling tools have been developed and used to drill holes in the hundred-micrometer range on printed circuit boards. To improve the productivity of the drilling process, printed circuit boards are generally stacked in several layers and drilled simultaneously. In this process, however, misalignment of the drilled holes on the top and bottom layers occurs, and this consequently degrades the overall product quality. To solve this problem, a new tool path strategy is proposed, which we refer to as the backstitch tool path. This approach is compared with a conventional tool path by examining the hole positioning error, drilling thrust force, drilling torque, and drilling duration under various drilling conditions. Applying the backstitch tool path strategy to a micro-drilling operation improved the productivity and product quality.
Language
English
URI
https://hdl.handle.net/10371/123675
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Mechanical Aerospace Engineering (기계항공공학부)Theses (Master's Degree_기계항공공학부)
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