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Determining stress-strain curve for micromaterials by finite-element modeling :
마이크로 소재의 응력-변형률 곡선 평가 : 레이저 간섭계에 의해 측정된 플립칩 솔더 변형과 나노인덴테이션으로부터 얻어진 박막의 하중-변위 곡선 유한요소해석 모델링

DC Field Value Language
dc.contributor.advisor권동일-
dc.contributor.author이백우-
dc.date.accessioned2009-11-18T02:33:25Z-
dc.date.available2009-11-18T02:33:25Z-
dc.date.copyright2004.-
dc.date.issued2004-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000055885eng
dc.identifier.urihttp://hdl.handle.net/10371/12761-
dc.descriptionThesis(doctoral)--서울대학교 대학원 :재료공학부,2004.eng
dc.format.extentxi, 150 leaveseng
dc.language.isoeneng
dc.publisher서울대학교 대학원eng
dc.subject기계적 신뢰성eng
dc.subjectMechanical reliabilityeng
dc.subject마이크로 소재eng
dc.subjectMicromaterialseng
dc.subject실험적eng
dc.subjectExperimentaleng
dc.subject계산적 하이브리드 방법eng
dc.subjectcomputational hybrid methodeng
dc.subject응력-변형률 곡선eng
dc.subjectStress-strain curveeng
dc.subject유한요소모델링eng
dc.subjectFinite-element modeling (FEM)eng
dc.subject플립칩eng
dc.subjectFlip-chipeng
dc.subject레이저 간섭계eng
dc.subjectElectronic speckle pattern interferometry (ESPI)eng
dc.subject박막eng
dc.subjectThin filmeng
dc.subject나노인덴테이션eng
dc.subjectNanoindentationeng
dc.subject파일업eng
dc.subjectPile-upeng
dc.subject싱크인eng
dc.subjectSink-ineng
dc.titleDetermining stress-strain curve for micromaterials by finite-element modeling :eng
dc.titleFlip-chip solder deformation measured by ESPI and thin film load-depth curve obtained by nanoindentationeng
dc.title.alternative마이크로 소재의 응력-변형률 곡선 평가 : 레이저 간섭계에 의해 측정된 플립칩 솔더 변형과 나노인덴테이션으로부터 얻어진 박막의 하중-변위 곡선 유한요소해석 모델링eng
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctoreng
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Ph.D. / Sc.D._재료공학부)
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