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Superfilling and leveling in damascene Cu electrodeposition for high performance semiconductor devices : 고성능 소자용 구리 전해 도금에서의 수퍼필링 및 레벨링
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 김재정 | - |
| dc.contributor.author | 조성기 | - |
| dc.date.accessioned | 2009-11-18T04:52:00Z | - |
| dc.date.available | 2009-11-18T04:52:00Z | - |
| dc.date.copyright | 2009. | - |
| dc.date.issued | 2009 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000036100 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/12974 | - |
| dc.description | Thesis(doctors) --서울대학교 대학원 :화학생물공학부, 2009.2. | eng |
| dc.format.extent | 128 leaves | eng |
| dc.language.iso | en | - |
| dc.publisher | 서울대학교 대학원 | eng |
| dc.subject | 구리 | eng |
| dc.subject | Cu | eng |
| dc.subject | 반도체 배선 | eng |
| dc.subject | interconnection | eng |
| dc.subject | 구리 전해 도금 | eng |
| dc.subject | Cu electrodeposition | eng |
| dc.subject | 유기 첨가제 | eng |
| dc.subject | organic additive | eng |
| dc.subject | 수퍼필링 | eng |
| dc.subject | superfilling | eng |
| dc.subject | 레벨링 | eng |
| dc.subject | leveling | eng |
| dc.subject | 씨앗층 회복 | eng |
| dc.subject | seed layer repairing | eng |
| dc.title | Superfilling and leveling in damascene Cu electrodeposition for high performance semiconductor devices | eng |
| dc.title.alternative | 고성능 소자용 구리 전해 도금에서의 수퍼필링 및 레벨링 | eng |
| dc.type | Thesis | - |
| dc.contributor.department | 화학생물공학부 | - |
| dc.description.degree | Doctor | eng |
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