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Superfilling and leveling in damascene Cu electrodeposition for high performance semiconductor devices
고성능 소자용 구리 전해 도금에서의 수퍼필링 및 레벨링

DC Field Value Language
dc.contributor.advisor김재정-
dc.contributor.author조성기-
dc.date.accessioned2009-11-18T04:52:00Z-
dc.date.available2009-11-18T04:52:00Z-
dc.date.copyright2009.-
dc.date.issued2009-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000036100eng
dc.identifier.urihttps://hdl.handle.net/10371/12974-
dc.descriptionThesis(doctors) --서울대학교 대학원 :화학생물공학부, 2009.2.eng
dc.format.extent128 leaveseng
dc.language.isoen-
dc.publisher서울대학교 대학원eng
dc.subject구리eng
dc.subjectCueng
dc.subject반도체 배선eng
dc.subjectinterconnectioneng
dc.subject구리 전해 도금eng
dc.subjectCu electrodepositioneng
dc.subject유기 첨가제eng
dc.subjectorganic additiveeng
dc.subject수퍼필링eng
dc.subjectsuperfillingeng
dc.subject레벨링eng
dc.subjectlevelingeng
dc.subject씨앗층 회복eng
dc.subjectseed layer repairingeng
dc.titleSuperfilling and leveling in damascene Cu electrodeposition for high performance semiconductor deviceseng
dc.title.alternative고성능 소자용 구리 전해 도금에서의 수퍼필링 및 레벨링eng
dc.typeThesis-
dc.contributor.department화학생물공학부-
dc.description.degreeDoctoreng
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Theses (Ph.D. / Sc.D._화학생물공학부)
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