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Nucleation and growth of bubbles in the ACF packaging process : 이방성전도필름을 이용한 실자공정의 기포성장에 대한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 안경현 | - |
| dc.contributor.author | 김상규 | - |
| dc.date.accessioned | 2009-11-18T07:52:13Z | - |
| dc.date.available | 2009-11-18T07:52:13Z | - |
| dc.date.copyright | 2007. | - |
| dc.date.issued | 2007 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000043992 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/13404 | - |
| dc.description | 학위논문(석사) --서울대학교 대학원 :화학생물공학부,2007. | eng |
| dc.format.extent | viii, 57 p. | eng |
| dc.language.iso | en | - |
| dc.publisher | 서울대학교 대학원 | eng |
| dc.subject | 이방성전도필름 | eng |
| dc.subject | Aniosotropic conductive film | eng |
| dc.subject | 기포기핵화 | eng |
| dc.subject | ACF | eng |
| dc.subject | 기포성장 | eng |
| dc.subject | decompression rate | eng |
| dc.subject | 감압율 | eng |
| dc.subject | chip on glass packaging | eng |
| dc.subject | 패키징 | eng |
| dc.subject | bubble nucleation | eng |
| dc.subject | 유한요소해석 | eng |
| dc.subject | bubble growth | eng |
| dc.subject | 칩 온 글래스 공정 | eng |
| dc.title | Nucleation and growth of bubbles in the ACF packaging process | eng |
| dc.title.alternative | 이방성전도필름을 이용한 실자공정의 기포성장에 대한 연구 | eng |
| dc.type | Thesis | - |
| dc.contributor.department | 화학생물공학부 | - |
| dc.description.degree | Master | eng |
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