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Reliability issues for high performance Cu interconnects : : 고성능구리배선 공정을 위한 신뢰성에 관한 연구 :

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dc.contributor.advisor김기범-
dc.contributor.author김기수-
dc.date.accessioned2009-11-18T22:20:13Z-
dc.date.available2009-11-18T22:20:13Z-
dc.date.copyright2007.-
dc.date.issued2007-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000042907eng
dc.identifier.urihttps://hdl.handle.net/10371/13516-
dc.description학위논문(박사)--서울대학교 대학원 :재료공학부,2007.eng
dc.format.extentxx, 168 p.eng
dc.language.isoeneng
dc.publisher서울대학교 대학원eng
dc.subject구리배선공정eng
dc.subjectcopper metallizationeng
dc.subject구리 확산eng
dc.subjectcopper migrationeng
dc.subject확산방지막eng
dc.subjectCu diffusioneng
dc.subject원자층증착법eng
dc.subjectdiffusion barriereng
dc.subject다공성 저유전율 유전재료eng
dc.subjectatomic layer deposition (ALD)eng
dc.subjectWNxCyeng
dc.subjectlow-k dielectriceng
dc.subjectSiOCHeng
dc.subjectnucleation and growtheng
dc.subjectinitial transient region of ALDeng
dc.subjectplasma treatmenteng
dc.subjectpore sealingeng
dc.subjectCueng
dc.subjectSiO2eng
dc.subjectWNxCyeng
dc.subjectSiOCHeng
dc.subjectcapacitance-voltage (C-V) measurementeng
dc.subjecttransmission electron microscopy (TEM)eng
dc.subjectbarrier performanceeng
dc.titleReliability issues for high performance Cu interconnects :eng
dc.titlecharacterization of Cu migration through dielectric materials and the atomic layer deposited transition metal nitride diffusion barriereng
dc.title유전체로의 구리의 확산과 원자층 증착법을 이용한 전이금속질화물 확산 방지막에 대한 연구eng
dc.title.alternative고성능구리배선 공정을 위한 신뢰성에 관한 연구 :eng
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctoreng
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