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Microstructure and electrical properties of damascene Cu and inkjet-printed Ag interconnects : 다마신 Cu 배선과 잉크젯 프린트된 Ag 배선의 미세조직과 전기적 비저항에 관한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 주영창 | - |
| dc.contributor.author | 정정규 | - |
| dc.date.accessioned | 2009-11-18T22:48:46Z | - |
| dc.date.available | 2009-11-18T22:48:46Z | - |
| dc.date.copyright | 2007. | - |
| dc.date.issued | 2007 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000045079 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/13587 | - |
| dc.description | Thesis(doctor`s)--서울대학교 대학원 :재료공학부,2007. | eng |
| dc.format.extent | xxvi, 258 p. | eng |
| dc.language.iso | en | eng |
| dc.publisher | 서울대학교 대학원 | eng |
| dc.subject | 미세조직 | eng |
| dc.subject | microstructure | eng |
| dc.subject | 전기적 비저항 | eng |
| dc.subject | electrical resistivity | eng |
| dc.subject | 나노입자 | eng |
| dc.subject | nanoparticles | eng |
| dc.subject | 다마신 Cu | eng |
| dc.subject | damascene copper | eng |
| dc.subject | 잉크젯 Ag | eng |
| dc.subject | inkjet-printed silver | eng |
| dc.title | Microstructure and electrical properties of damascene Cu and inkjet-printed Ag interconnects | eng |
| dc.title.alternative | 다마신 Cu 배선과 잉크젯 프린트된 Ag 배선의 미세조직과 전기적 비저항에 관한 연구 | eng |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Doctor | eng |
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