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ULSI용 구리배선에서의 도금공정 및 전기화학적 특성 분석 : A study on the electroplating process and electrochemical characteristics for Cu interconnect
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- Authors
- Advisor
- 강탁
- Issue Date
- 2007
- Publisher
- 서울대학교 대학원
- Keywords
- 도금 ; electroplating ; damascene ; damascene ; superfilling ; superfilling ; 유기 첨가제 ; additives ; 부식 ; corrosion ; self anneal ; self anneal
- Description
- 학위논문(박사) --서울대학교 대학원 :재료공학부,2007.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000042934
https://hdl.handle.net/10371/13593
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