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반도체 배선용 Cu(Mg) 박막의 전기적 신뢰성 평가 : Evaluation of electric reliabilities of Cu(Mg) film in ULSI interconnects
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- Authors
- Advisor
- 주영창
- Issue Date
- 2005
- Publisher
- 서울대학교 대학원
- Keywords
- 구리마그네슘박막 ; Cu(Mg) ; 합금화 ; MgO ; 산화마그네슘 ; Reliability ; 전기적신뢰성 ; Time dependence dielectric breakdown ; 절연체파괴시간 ; Time to failure
- Description
- 학위논문(석사)--서울대학교 대학원 :재료공학부,2005.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000051026
https://hdl.handle.net/10371/14327
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