Publications
Detailed Information
SnPb계 및 SnAg계 플립칩 솔더의 electromigration 특성 평가
Cited 0 time in
Web of Science
Cited 0 time in Scopus
- Authors
- Advisor
- 주영창
- Issue Date
- 2003
- Publisher
- 서울대학교 대학원
- Keywords
- Electromigration ; Electromigration ; 플립칩 솔더 범프 ; Flip chip solder bump ; 활성화 에너지 ; Activation energy
- Description
- 학위논문(석사)--서울대학교 대학원 :재료공학부,2003.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000057606
https://hdl.handle.net/10371/14699
- Files in This Item:
- There are no files associated with this item.
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.