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3차원 전위 동역학을 이용한 copper via의 열피로 현상 해석 : (A)Study on thermal fatigue behavior in copper via using 3D discrete dislocation dynamics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 오규환 | - |
| dc.contributor.author | 김규석 | - |
| dc.date.accessioned | 2009-11-25 | - |
| dc.date.available | 2009-11-25 | - |
| dc.date.copyright | 2007. | - |
| dc.date.issued | 2007 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000045719 | kor |
| dc.identifier.uri | https://hdl.handle.net/10371/14843 | - |
| dc.description | 학위논문(석사)--서울대학교 대학원 :재료공학부,2007. | kor |
| dc.format.extent | v, 46 장 | kor |
| dc.language.iso | ko | - |
| dc.publisher | 서울대학교 대학원 | kor |
| dc.subject | copper via | kor |
| dc.subject | copper via | kor |
| dc.subject | 전위동역학 | kor |
| dc.subject | 3D Discrete Dislocation Dynamics | kor |
| dc.subject | 열피로 | kor |
| dc.title | 3차원 전위 동역학을 이용한 copper via의 열피로 현상 해석 | kor |
| dc.title.alternative | (A)Study on thermal fatigue behavior in copper via using 3D discrete dislocation dynamics | kor |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Master | kor |
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