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열 저항을 감소시킨 InGaP/GaAs HBT 소자의 열 특성 성능 향상에 관한 연구
A study on improvement in Thermal Performance of InGaP/GaAs HBT Device by Reducing Thermal Resistance

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Authors
김규태
Advisor
권영우
Major
전기. 컴퓨터공학부
Issue Date
2011-02
Publisher
서울대학교 대학원
Keywords
전력 소자열 저항Heat spreading열 시뮬레이션QFIGMSK로드풀High power deviceThermal resistanceThermal simulationLoadpull
Description
학위논문 (석사)-- 서울대학교 대학원 : 전기. 컴퓨터공학부, 2011.2. 권영우.
Language
kor
URI
https://hdl.handle.net/10371/159546

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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Theses (Master's Degree_전기·정보공학부)
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