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Robotic four-dimensional pixel assembly of van der Waals solids

Cited 56 time in Web of Science Cited 59 time in Scopus
Authors

Mannix, Andrew J.; Ye, Andrew; Sung, Suk Hyun; Ray, Ariana; Mujid, Fauzia; Park, Chibeom; Lee, Myungjae; Kang, Jong-Hoon; Shreiner, Robert; High, Alexander A.; Muller, David A.; Hovden, Robert; Park, Jiwoong

Issue Date
2022-04
Publisher
Nature Publishing Group
Citation
Nature Nanotechnology, Vol.17 No.4, pp.361-+
Abstract
Van der Waals (vdW) solids can be engineered with atomically precise vertical composition through the assembly of layered two-dimensional materials(1,2). However, the artisanal assembly of structures from micromechanically exfoliated flakes(3,4) is not compatible with scalable and rapid manufacturing. Further engineering of vdW solids requires precisely designed and controlled composition over all three spatial dimensions and interlayer rotation. Here, we report a robotic four-dimensional pixel assembly method for manufacturing vdW solids with unprecedented speed, deliberate design, large area and angle control. We used the robotic assembly of prepatterned 'pixels' made from atomically thin two-dimensional components. Wafer-scale two-dimensional material films were grown, patterned through a clean, contact-free process and assembled using engineered adhesive stamps actuated by a high-vacuum robot. We fabricated vdW solids with up to 80 individual layers, consisting of 100 x 100 mu m(2) areas with predesigned patterned shapes, laterally/vertically programmed composition and controlled interlayer angle. This enabled efficient optical spectroscopic assays of the vdW solids, revealing new excitonic and absorbance layer dependencies in MoS2. Furthermore, we fabricated twisted N-layer assemblies, where we observed atomic reconstruction of twisted four-layer WS2 at high interlayer twist angles of >= 4 degrees. Our method enables the rapid manufacturing of atomically resolved quantum materials, which could help realize the full potential of vdW heterostructures as a platform for novel physics(2,5,6) and advanced electronic technologies(7,8).
ISSN
1748-3387
URI
https://hdl.handle.net/10371/183215
DOI
https://doi.org/10.1038/s41565-021-01061-5
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