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Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jee, Sung Min | - |
dc.contributor.author | Ahn, Cheol-Hee | - |
dc.contributor.author | Park, Jong Hyuk | - |
dc.contributor.author | Kim, Tae Ann | - |
dc.contributor.author | Park, Min | - |
dc.date.accessioned | 2023-07-10T07:05:42Z | - |
dc.date.available | 2023-07-10T07:05:42Z | - |
dc.date.created | 2020-11-30 | - |
dc.date.issued | 2020-12-01 | - |
dc.identifier.citation | Composites Part B: Engineering, Vol.202, p. 108438 | - |
dc.identifier.issn | 1359-8368 | - |
dc.identifier.uri | https://hdl.handle.net/10371/194948 | - |
dc.description.abstract | One-component epoxy adhesives, in which the epoxy resin and curing agent are premixed, have many commercial advantages including reduced working time and stable performance. However, these adhesives suffer from a short shelf life even at room temperature. Here, core-shell structured curing agents were prepared via a dry particle coating (DPC) process that improved the storage stability of one-component epoxy adhesives. The DPC process is a simple, economic, and solvent-free method to fabricate core-shell structured materials using mechanical forces. Graphene nanoplatelets (GNPs) were used as encapsulating materials due to their high thermal conductivity and large surface areas. With the GNP-encapsulated curing agents, a one-component epoxy adhesive displayed significantly enhanced storage stability while maintaining its fast curing behavior. In particular, the pot life of the adhesive increased to 60 days, which is over two-times longer than that of a pristine epoxy adhesive. The curing temperature increased by up to 5.6 degrees C, which is a smaller increase than that observed when non-thermally conductive materials were used for encapsulation. Furthermore, the GNPs provided reinforcement in the cured epoxy adhesive, thereby improving the lap shear strength by 20-30%. | - |
dc.language | 영어 | - |
dc.publisher | Pergamon Press Ltd. | - |
dc.title | Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.compositesb.2020.108438 | - |
dc.citation.journaltitle | Composites Part B: Engineering | - |
dc.identifier.wosid | 000581932100040 | - |
dc.identifier.scopusid | 2-s2.0-85091904984 | - |
dc.citation.startpage | 108438 | - |
dc.citation.volume | 202 | - |
dc.description.isOpenAccess | Y | - |
dc.contributor.affiliatedAuthor | Ahn, Cheol-Hee | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.subject.keywordPlus | NANOCOMPOSITES | - |
dc.subject.keywordPlus | COMPOSITES | - |
dc.subject.keywordPlus | MICROENCAPSULATION | - |
dc.subject.keywordPlus | STRENGTH | - |
dc.subject.keywordPlus | FRACTURE | - |
dc.subject.keywordAuthor | Thermosetting resin | - |
dc.subject.keywordAuthor | Cure behavior | - |
dc.subject.keywordAuthor | Mechanical properties | - |
dc.subject.keywordAuthor | Thermal analysis | - |
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