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Polytope Sector-Based Synthesis and Analysis of Microstructural Architectures With Tunable Thermal Conductivity and Expansion

DC Field Value Language
dc.contributor.authorHopkins, Jonathan B.-
dc.contributor.authorSong, Yuanping-
dc.contributor.authorLee, Howon-
dc.contributor.authorFang, Nicholas X.-
dc.contributor.authorSpadaccini, Christopher M.-
dc.date.accessioned2024-05-14T06:28:58Z-
dc.date.available2024-05-14T06:28:58Z-
dc.date.created2021-03-30-
dc.date.created2021-03-30-
dc.date.created2021-03-30-
dc.date.issued2016-05-
dc.identifier.citationJournal of Mechanical Design - Transactions of the ASME, Vol.138 No.5, p. 051401-
dc.identifier.issn1050-0472-
dc.identifier.urihttps://hdl.handle.net/10371/201819-
dc.description.abstractThe aim of this paper is to (1) introduce an approach, called polytope sector-based synthesis (PSS), for synthesizing 2D or 3D microstructural architectures that exhibit a desired bulk-property directionality (e.g., isotropic, cubic, orthotropic, etc.), and (2) provide general analytical methods that can be used to rapidly optimize the geometric parameters of these architectures such that they achieve a desired combination of bulk thermal conductivity and thermal expansion properties. Although the methods introduced can be applied to general beam-based microstructural architectures, we demonstrate their utility in the context of an architecture that can be tuned to achieve a large range of extreme thermal expansion coefficients-positive, zero, and negative. The materialproperty- combination region that can be achieved by this architecture is determined within an Ashby-material-property plot of thermal expansion versus thermal conductivity using the analytical methods introduced. These methods are verified using finite-element analysis (FEA) and both 2D and 3D versions of the design have been fabricated using projection microstereolithography.-
dc.language영어-
dc.publisherAmerican Society of Mechanical Engineers-
dc.titlePolytope Sector-Based Synthesis and Analysis of Microstructural Architectures With Tunable Thermal Conductivity and Expansion-
dc.typeArticle-
dc.identifier.doi10.1115/1.4032809-
dc.citation.journaltitleJournal of Mechanical Design - Transactions of the ASME-
dc.identifier.wosid000374241900002-
dc.identifier.scopusid2-s2.0-84963771984-
dc.citation.number5-
dc.citation.startpage051401-
dc.citation.volume138-
dc.description.isOpenAccessY-
dc.contributor.affiliatedAuthorLee, Howon-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.subject.keywordPlusHEAT-TRANSFER-
dc.subject.keywordPlusDESIGN-
dc.subject.keywordPlusTOPOLOGY-
dc.subject.keywordPlusOPTIMIZATION-
dc.subject.keywordAuthormicrostructural architectures-
dc.subject.keywordAuthormicroarchitectured materials-
dc.subject.keywordAuthorcellular materials-
dc.subject.keywordAuthorthermal expansion-
dc.subject.keywordAuthorthermal conductivity-
dc.subject.keywordAuthoranalytical optimization-
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  • College of Engineering
  • Department of Mechanical Engineering
Research Area Additive Manufacturing, Architected Materials, Programmable Matter

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