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Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array

DC Field Value Language
dc.contributor.authorKim, Byoung-Joon-
dc.contributor.authorCho, Yigil-
dc.contributor.authorJung, Min-Suk-
dc.contributor.authorShin, Hae-A-Seul-
dc.contributor.authorMoon, Myoung-Woon-
dc.contributor.authorHan, Heung Nam-
dc.contributor.authorNam, Ki Tae-
dc.contributor.authorJoo, Young-Chang-
dc.contributor.authorChoi, In Suk-
dc.date.accessioned2024-05-17T08:06:15Z-
dc.date.available2024-05-17T08:06:15Z-
dc.date.created2021-05-06-
dc.date.issued2012-11-
dc.identifier.citationSmall, Vol.8 No.21, pp.3300-3306-
dc.identifier.issn1613-6810-
dc.identifier.urihttps://hdl.handle.net/10371/203319-
dc.description.abstractDesign and fabrication of reliable electrodes is one of the most important challenges in flexible devices, which undergo repeated deformation. In conventional approaches, mechanical and electrical properties of continuous metal films degrade gradually because of the fatigue damage. The designed incorporation of nanoholes into Cu electrodes can enhance the reliability. In this study, the electrode shows extremely low electrical resistance change during bending fatigue because the nanoholes suppress crack initiation by preventing protrusion formation and damage propagation by crack tip blunting. This concept provides a key guideline for developing fatigue-free flexible electrodes.-
dc.language영어-
dc.publisherWiley - V C H Verlag GmbbH & Co.-
dc.titleFatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array-
dc.typeArticle-
dc.identifier.doi10.1002/smll.201200674-
dc.citation.journaltitleSmall-
dc.identifier.wosid000310600600009-
dc.identifier.scopusid2-s2.0-84868368667-
dc.citation.endpage3306-
dc.citation.number21-
dc.citation.startpage3300-
dc.citation.volume8-
dc.description.isOpenAccessN-
dc.contributor.affiliatedAuthorHan, Heung Nam-
dc.contributor.affiliatedAuthorNam, Ki Tae-
dc.contributor.affiliatedAuthorJoo, Young-Chang-
dc.contributor.affiliatedAuthorChoi, In Suk-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.subject.keywordPlusFILMS-
dc.subject.keywordPlusDEFORMATION-
dc.subject.keywordPlusMICROMECHANICS-
dc.subject.keywordPlusTRANSPARENT-
dc.subject.keywordPlusNANOWIRES-
dc.subject.keywordPlusPAPER-
dc.subject.keywordAuthorbending-
dc.subject.keywordAuthorconductivity-
dc.subject.keywordAuthorcopper-
dc.subject.keywordAuthorelectrodes-
dc.subject.keywordAuthornanostructures-
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  • College of Engineering
  • Department of Materials Science & Engineering
Research Area High Temperature Alloys, High Strength , Nano Mechanics and Nano Structure Design for Ultra Strong Materials, Shape and Pattern Design for Engineering Materials

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