Electromigration-induced via failure assisted by neighboring clusters

Abstract

With different locations of a cluster, stress evolutions at a via are simulated. Via fails fastest at a specific location of a cluster, which is named fastest stress enhancing polygranular cluster position (FaSEPP). Suggested model and simulated results show that FaSEPP decreases with increasing current density but does not vary with temperature. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.