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200-mm-wafer-scale integration of polycrystalline molybdenum disulfide transistors
DC Field | Value | Language |
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dc.contributor.author | Kwon, Junyoung | - |
dc.contributor.author | Seol, Minsu | - |
dc.contributor.author | Yoo, Joungeun | - |
dc.contributor.author | Ryu, Huije | - |
dc.contributor.author | Ko, Dong-Su | - |
dc.contributor.author | Lee, Min-Hyun | - |
dc.contributor.author | Lee, Eun Kyu | - |
dc.contributor.author | Yoo, Min Seok | - |
dc.contributor.author | Lee, Gwan-Hyoung | - |
dc.contributor.author | Shin, Hyeon-Jin | - |
dc.contributor.author | Kim, Jeehwan | - |
dc.contributor.author | Byun, Kyung-Eun | - |
dc.date.accessioned | 2024-05-20T06:11:26Z | - |
dc.date.available | 2024-05-20T06:11:26Z | - |
dc.date.created | 2024-05-20 | - |
dc.date.created | 2024-05-20 | - |
dc.date.issued | 2024-05 | - |
dc.identifier.citation | Nature Electronics, Vol.7 No.5 | - |
dc.identifier.issn | 2520-1131 | - |
dc.identifier.uri | https://hdl.handle.net/10371/203430 | - |
dc.description.abstract | Two-dimensional semiconductors are an attractive material for making thin-film transistors due to their scalability, transferability, atomic thickness and relatively high carrier mobility. There is, however, a gap in performance between single-device demonstrations, which typically use single-crystalline two-dimensional films, and devices that can be integrated on a large scale using industrial methods. Here we report the 200-mm-wafer-scale integration of polycrystalline molybdenum disulfide (MoS2) field-effect transistors. Our processes are compatible with industry, with processing performed in a commercial 200 mm fabrication facility with a yield of over 99.9%. We find that the metal-semiconductor junction in polycrystalline MoS2 is fundamentally different from its single-crystalline counterpart, and therefore, we redesign the process flow to nearly eliminate the Schottky barrier height at the metal-MoS2 contact. The resulting MoS2 field-effect transistors exhibit mobilities of 21 cm2 V-1 s-1, contact resistances of 3.8 k Omega mu m and on-current densities of 120 mu A mu m-1, which are similar to those achieved with single-crystalline flakes. A method for integrating polycrystalline molybdenum disulfide using processes in a 200 mm fab facility can create transistors with high robustness and performance comparable with single-crystalline devices. | - |
dc.language | 영어 | - |
dc.publisher | NATURE PUBLISHING GROUP | - |
dc.title | 200-mm-wafer-scale integration of polycrystalline molybdenum disulfide transistors | - |
dc.type | Article | - |
dc.identifier.doi | 10.1038/s41928-024-01158-4 | - |
dc.citation.journaltitle | Nature Electronics | - |
dc.identifier.wosid | 001207599000001 | - |
dc.identifier.scopusid | 2-s2.0-85191143956 | - |
dc.citation.number | 5 | - |
dc.citation.volume | 7 | - |
dc.description.isOpenAccess | N | - |
dc.contributor.affiliatedAuthor | Lee, Gwan-Hyoung | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.subject.keywordPlus | MOS2 MONOLAYERS | - |
dc.subject.keywordPlus | CONTACTS | - |
dc.subject.keywordPlus | GROWTH | - |
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