Micro/nanoscale structure fabrication by direct nanoimprinting of metallic and semiconducting nanoparticles

Abstract

In this paper, we present our recent development of direct nanoimprinting of metal and semiconductor nanoparticles for a simple but high-throughput fabrication of micro/nanoscale structures. Nanoparticle suspension with self-assembled-monolayer (SAM) protected-nanoparticles (Au, Ag, and CdSe-ZnS core-shell quantum dots) suspended in alpha-terpineol carrier solvent are used as solutions for direct nanoimprinting. Polydimethylsiloxane (PDMS)-based soft imprinting molds with micro/nanoscale features are used. Process and material flexibility enable a very low temperature (80 degrees C) and low pressure (5psi) nanoimprinting process and results in superfine features from micrometers down to similar to 100nm resolutions. We will show the geometrical and electrical characterization of nanoimprinted structures and demonstrate working electronic components such as resistors or organic field effect transistors (OFET).