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Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics

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dc.contributor.authorKo, Seung Hwan-
dc.contributor.authorChung, Jaewon-
dc.contributor.authorChoi, Yeonho-
dc.contributor.authorHwang, David J.-
dc.contributor.authorGrigoropoulos, Costas P.-
dc.contributor.authorPoulikakos, Dimos-
dc.date.accessioned2024-08-08T01:50:26Z-
dc.date.available2024-08-08T01:50:26Z-
dc.date.created2024-06-25-
dc.date.created2024-06-25-
dc.date.issued2006-
dc.identifier.citationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, Vol.PART C, pp.1935-1941-
dc.identifier.urihttps://hdl.handle.net/10371/208559-
dc.description.abstractThe low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand(DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nano-particles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics. Copyright © 2005 by ASME.-
dc.language영어-
dc.publisherASME-
dc.titleSubtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics-
dc.typeArticle-
dc.citation.journaltitleProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005-
dc.identifier.wosid000241978202047-
dc.identifier.scopusid2-s2.0-32844472229-
dc.citation.endpage1941-
dc.citation.startpage1935-
dc.citation.volumePART C-
dc.description.isOpenAccessN-
dc.contributor.affiliatedAuthorKo, Seung Hwan-
dc.type.docTypeConference Paper-
dc.description.journalClass1-
dc.subject.keywordAuthorAblation-
dc.subject.keywordAuthorFlexible electronics-
dc.subject.keywordAuthorGold-
dc.subject.keywordAuthorInkjet-
dc.subject.keywordAuthorLaser-
dc.subject.keywordAuthorNanoparticle-
dc.subject.keywordAuthorSintering-
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Related Researcher

  • College of Engineering
  • Department of Mechanical Engineering
Research Area Laser Assisted Patterning, Liquid Crystal Elastomer, Stretchable Electronics, 로보틱스, 스마트 제조, 열공학

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