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Fabrication of inkjet printed flexible electronics by low temperature subtractive laser processing

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dc.contributor.authorKo, Seung Hwan-
dc.contributor.authorChung, Jaewon-
dc.contributor.authorChoi, Yeonho-
dc.contributor.authorGrigoropoulos, Costas P.-
dc.contributor.authorPoulikakos, Dimos-
dc.date.accessioned2024-08-08T01:50:45Z-
dc.date.available2024-08-08T01:50:45Z-
dc.date.created2024-06-25-
dc.date.created2024-06-25-
dc.date.issued2005-
dc.identifier.citationELECTRONIC AND PHOTONIC PACKAGING, INTEGRATION AND PACKAGING OF MICRO/NANO/ELECTRONIC SYSTEMS, pp.599-603-
dc.identifier.urihttps://hdl.handle.net/10371/208609-
dc.description.abstractThe low temperature fabrication of passive electrical components (resistor, capacitor) on flexible substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print passive electrical components from gold nano-particles suspended in Alpha-Terpineol solution on a flexible polymer substrate. PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent was inkjet-printed as dielectric layer for capacitor. A pulsed laser beam was irradiated to produce finer electrical components, thereby overcoming the inherent limitation of inkjet processing. A continuous Ar laser beam was irradiated locally to evaporate carrier solvent as well as to cure the gold nano-particles in order to improve the electrical resistivity. Conductor lines and capacitors were fabricated on polymer substrate and their performance was analyzed.-
dc.language영어-
dc.publisherAMER SOC MECHANICAL ENGINEERS-
dc.titleFabrication of inkjet printed flexible electronics by low temperature subtractive laser processing-
dc.typeArticle-
dc.identifier.doi10.1115/IMECE2005-80535-
dc.citation.journaltitleELECTRONIC AND PHOTONIC PACKAGING, INTEGRATION AND PACKAGING OF MICRO/NANO/ELECTRONIC SYSTEMS-
dc.identifier.wosid000243398600075-
dc.identifier.scopusid2-s2.0-33645080206-
dc.citation.endpage603-
dc.citation.startpage599-
dc.description.isOpenAccessN-
dc.contributor.affiliatedAuthorKo, Seung Hwan-
dc.type.docTypeProceedings Paper-
dc.description.journalClass1-
dc.subject.keywordAuthorflexible electronics-
dc.subject.keywordAuthornanoparticle-
dc.subject.keywordAuthorgold-
dc.subject.keywordAuthorinkjet-
dc.subject.keywordAuthorlaser ablation and sintering-
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Related Researcher

  • College of Engineering
  • Department of Mechanical Engineering
Research Area Laser Assisted Patterning, Liquid Crystal Elastomer, Stretchable Electronics, 로보틱스, 스마트 제조, 열공학

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