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Fabrication of inkjet printed flexible electronics by low temperature subtractive laser processing
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ko, Seung Hwan | - |
dc.contributor.author | Chung, Jaewon | - |
dc.contributor.author | Choi, Yeonho | - |
dc.contributor.author | Grigoropoulos, Costas P. | - |
dc.contributor.author | Poulikakos, Dimos | - |
dc.date.accessioned | 2024-08-08T01:50:45Z | - |
dc.date.available | 2024-08-08T01:50:45Z | - |
dc.date.created | 2024-06-25 | - |
dc.date.created | 2024-06-25 | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | ELECTRONIC AND PHOTONIC PACKAGING, INTEGRATION AND PACKAGING OF MICRO/NANO/ELECTRONIC SYSTEMS, pp.599-603 | - |
dc.identifier.uri | https://hdl.handle.net/10371/208609 | - |
dc.description.abstract | The low temperature fabrication of passive electrical components (resistor, capacitor) on flexible substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print passive electrical components from gold nano-particles suspended in Alpha-Terpineol solution on a flexible polymer substrate. PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent was inkjet-printed as dielectric layer for capacitor. A pulsed laser beam was irradiated to produce finer electrical components, thereby overcoming the inherent limitation of inkjet processing. A continuous Ar laser beam was irradiated locally to evaporate carrier solvent as well as to cure the gold nano-particles in order to improve the electrical resistivity. Conductor lines and capacitors were fabricated on polymer substrate and their performance was analyzed. | - |
dc.language | 영어 | - |
dc.publisher | AMER SOC MECHANICAL ENGINEERS | - |
dc.title | Fabrication of inkjet printed flexible electronics by low temperature subtractive laser processing | - |
dc.type | Article | - |
dc.identifier.doi | 10.1115/IMECE2005-80535 | - |
dc.citation.journaltitle | ELECTRONIC AND PHOTONIC PACKAGING, INTEGRATION AND PACKAGING OF MICRO/NANO/ELECTRONIC SYSTEMS | - |
dc.identifier.wosid | 000243398600075 | - |
dc.identifier.scopusid | 2-s2.0-33645080206 | - |
dc.citation.endpage | 603 | - |
dc.citation.startpage | 599 | - |
dc.description.isOpenAccess | N | - |
dc.contributor.affiliatedAuthor | Ko, Seung Hwan | - |
dc.type.docType | Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.subject.keywordAuthor | flexible electronics | - |
dc.subject.keywordAuthor | nanoparticle | - |
dc.subject.keywordAuthor | gold | - |
dc.subject.keywordAuthor | inkjet | - |
dc.subject.keywordAuthor | laser ablation and sintering | - |
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