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Study on the fabrication of flip chip lead-free solder bump by electroplating : 전해도금에 의한 플립칩 무연 솔더 범프 제작에 관한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 강춘식 | - |
| dc.contributor.author | 황현 | - |
| dc.date.accessioned | 2010-01-15T02:32:38Z | - |
| dc.date.available | 2010-01-15T02:32:38Z | - |
| dc.date.copyright | 2002. | - |
| dc.date.issued | 2002 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000061997 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/30333 | - |
| dc.description | Thesis (master`s)--서울대학교 대학원 :재료공학부,2002. | en |
| dc.format.extent | vi, 52 leaves | en |
| dc.language.iso | en | en |
| dc.publisher | 서울대학교 대학원 | en |
| dc.title | Study on the fabrication of flip chip lead-free solder bump by electroplating | en |
| dc.title.alternative | 전해도금에 의한 플립칩 무연 솔더 범프 제작에 관한 연구 | - |
| dc.type | Thesis | - |
| dc.contributor.department | 재료공학부 | - |
| dc.description.degree | Master | en |
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