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Improved diffusion barrier by stuffing the grain boundaries of TIN with a thin A1 interlayer for Cu metallization : A1 중간층을 이용하여 TiN 결정립계를 충진한 Cu 배선공정을 위한 확산방지막에 관한 연구
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- Authors
- Advisor
- 김기범
- Issue Date
- 2002
- Publisher
- 서울대학교 대학원
- Description
- Thesis (master`s)--서울대학교 대학원 :재료공학부,2002.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000061996
https://hdl.handle.net/10371/30334
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