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냉각효과를 고려한 사출성형 후충전과정 해석 프로그램 개발
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- Authors
- Advisor
- 신효철
- Issue Date
- 2001
- Publisher
- 서울대학교 대학원
- Keywords
- 후충전과정 ; 보압과정 ; 냉각과정 ; 사출성형 ; 금형벽면온도 ; 온도경계조건 ; Injection molding ; post-filling ; packing ; cooling ; mold wall temperature
- Description
- 학위논문(석사)--서울대학교 대학원 :기계항공공학부,2001.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000065427
https://hdl.handle.net/10371/33797
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