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전기전자 재료용 Cu-Mn-(Ni,Fe)-P 합금의 석출거동과 전기적 성질
Precipitation behavior and electrical properties of Cu-Mn-(Ni,Fe)-P alloys for electrical and electronic materials

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Authors
최준환
Advisor
이동녕
Issue Date
1999
Publisher
서울대학교 대학원
Keywords
TEMdiffraction patternHRTEMorientation relationship회절도형방위관계leadframe
Description
학위논문(박사)--서울대학교 대학원 :금속공학과,1999.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000071440

http://hdl.handle.net/10371/34596
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Ph.D. / Sc.D._재료공학부)
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