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A study on partial melting soldering process and reliability for Pb-free flip chip package : 무연솔더 플립칩 패키지를 위한 부분용융솔더링법의 개발과 신뢰성에 관한 연구
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- Authors
- Advisor
- 강춘식
- Issue Date
- 2002
- Publisher
- 서울대학교 대학원
- Keywords
- partial melting soldering ; 부분용융솔더링 ; Flip Chip ; 플립칩 ; Intermetallic Compound ; 무연솔더 ; Reliability ; 금속간화합물 ; Thermal Fatigue ; 신뢰성 ; 열피로
- Description
- Thesis (doctoral)--서울대학교 대학원 :재료공학부,2002.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000062865
https://hdl.handle.net/10371/35411
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