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Investigation of CMP-induced delamination in CuUltra Low-K interconnect system by FEM stress analysis
FEM 응력 해석을 이용한 CuUltra Low-K CMP 공정에서 발생하는 박리현상에 관한 연구

DC Field Value Language
dc.contributor.advisor오수익-
dc.contributor.author김기현-
dc.date.accessioned2010-01-21T09:21:35Z-
dc.date.available2010-01-21T09:21:35Z-
dc.date.copyright2007.-
dc.date.issued2007-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000045110eng
dc.identifier.urihttps://hdl.handle.net/10371/41257-
dc.descriptionThesis(doctor`s)--서울대학교 대학원 :기계항공공학부,2007.en
dc.format.extentxiii, 167 leavesen
dc.language.isoenen
dc.publisher서울대학교 대학원en
dc.subject화학적 기계연마en
dc.subjectChemical mechanical polishingen
dc.subject박리en
dc.subjectDelaminationen
dc.subject초저유전물진en
dc.subjectUltra low-Ken
dc.subject응력해석en
dc.subjectStress analysisen
dc.subjectFE 시뮬레이션en
dc.subjectFE simulationen
dc.titleInvestigation of CMP-induced delamination in CuUltra Low-K interconnect system by FEM stress analysisen
dc.title.alternativeFEM 응력 해석을 이용한 CuUltra Low-K CMP 공정에서 발생하는 박리현상에 관한 연구en
dc.typeThesis-
dc.contributor.department기계항공공학부-
dc.description.degreeDoctoren
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Mechanical Aerospace Engineering (기계항공공학부)Theses (Ph.D. / Sc.D._기계항공공학부)
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