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College of Engineering/Engineering Practice School (공과대학/대학원)
Dept. of Electrical and Computer Engineering (전기·정보공학부)
Theses (Master's Degree_전기·정보공학부)
Epi poly를 이용한 MEMS 소자용 웨이퍼 단위의 진공 패키징에 대한 연구
- Authors
- 오창훈
- Advisor
- 전국진
- Issue Date
- 2000
- Publisher
- 서울대학교 대학원
- Description
- 학위논문(석사)--서울대학교 대학원 :전기공학부,2000.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000068294
http://hdl.handle.net/10371/42603
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