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Epi poly를 이용한 MEMS 소자용 웨이퍼 단위의 진공 패키징에 대한 연구

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Authors
오창훈
Advisor
전국진
Issue Date
2000
Publisher
서울대학교 대학원
Description
학위논문(석사)--서울대학교 대학원 :전기공학부,2000.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000068294

http://hdl.handle.net/10371/42603
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Theses (Master's Degree_전기·정보공학부)
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