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Flip-chip된 초고주파 전력 증폭기의 열 특성 연구
(A) Study on Thermal Characterization of Microwave Power Amplifier using Flip-chip Technology

DC Field Value Language
dc.contributor.advisor권영우-
dc.contributor.author오정민-
dc.date.accessioned2010-01-26T06:12:27Z-
dc.date.available2010-01-26T06:12:27Z-
dc.date.copyright2009.-
dc.date.issued2009-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000038735kog
dc.identifier.urihttps://hdl.handle.net/10371/44684-
dc.description학위논문(석사) --서울대학교 대학원 :전기. 컴퓨터공학부,2009.8.ko
dc.format.extent43장ko
dc.language.isokoko
dc.publisher서울대학교 대학원ko
dc.subjectpower amplifierko
dc.subjectpower amplifierko
dc.subjectstacked FETko
dc.subjectstacked FETko
dc.subjectflip-chip technologyko
dc.subjectflip-chip technologyko
dc.subjectflip-chipthermal performanceko
dc.subjectflip-chipthermal performanceko
dc.subjectthermal resistanceko
dc.subjectthermal resistanceko
dc.titleFlip-chip된 초고주파 전력 증폭기의 열 특성 연구ko
dc.title.alternative(A) Study on Thermal Characterization of Microwave Power Amplifier using Flip-chip Technologyko
dc.typeThesis-
dc.contributor.department전기. 컴퓨터공학부-
dc.description.degreeMasterko
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Theses (Master's Degree_전기·정보공학부)
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