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초음파를 이용한 방전가공에서의 미세 장공 가공 : Deep hole micro EDM with ultrasonic vibration
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- Authors
- Advisor
- 주종남
- Issue Date
- 2003
- Publisher
- 서울대학교 대학원
- Keywords
- 초음파 부가 미세 방전가공 ; Micro electrical discharge machining ; 현가 지그 ; Aspect ratio ; 세장비 ; Ultrasonic vibration
- Description
- 학위논문(박사)--서울대학교 대학원 :기계설계학과,2003.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000059947
https://hdl.handle.net/10371/44866
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