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Detailed Information
Advanced metallization for high performance devices using superconformal Cu electrodeposition : 초등각 구리 전착(電着)을 이용한 고성능 소자용 고급 금속화 공정
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- Authors
- Advisor
- 김재정
- Issue Date
- 2004
- Publisher
- 서울대학교 대학원
- Keywords
- 구리 ; Cu ; 배선 ; interconnection ; 초등각 전착 ; superconformal electrodeposition ; 씨드층 ; seed layer ; 첨가제 ; additive ; 확산 방지막 ; diffusion barrier
- Description
- Thesis(doctoral)--서울대학교 대학원 :응용화학부,2004.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000055733
https://hdl.handle.net/10371/44930
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