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Topology insensitive rivet packaging using sidewall bond principle : 측면 접합 원리를 이용하는 표면형상에 둔감한 리벳 패키징
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- Authors
- Advisor
- 전국진
- Issue Date
- 2007
- Publisher
- 서울大學校 大學院
- Keywords
- 표면형상에 둔감한 ; topology insensitive ; 기밀 실장 ; hermetic encapsulation ; 레고 어셈블리 ; LEGO-like assembly ; 리벳 효과 ; ‘riveting’ effect ; 관통비아 전기적 연결 ; through-via interconnection ; 가속가압누설 검출 ; accelerated pressurized leak detection
- Description
- Thesis(doctor`s)--서울大學校 大學院 :電氣·컴퓨터工學部,2007.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000045172
https://hdl.handle.net/10371/48931
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